![]() ![]() Once a Magnum V is calibrated, the calibration tables match the customer device specific DSA’s that are loaded into the TIU. Ultra low leakage, less than 5 femto amps/volt - room temp to 75C. The DSA TCALDX options are handler specific calibration units specifically designed for a customer selected TIU. Core competencies: high performance probe cards, low leakage cables and interfaces. Magnum V K52 interface provides a direct dock, tower-less connection to the probe card for lowest cost and maximum performance. The wafer sort SSV TIU can be swapped with any final test SSV TIU to provide for maximum flexibility in the production test environment. The SSV wafer sort TIU employs the K52 probe interface used on multiple Teradyne wafer sort system configurations. For a 1 pico amp measurement, settling time would be. The settling time for a 5 fempto amp measurement would be. This eliminates the need for costly 3rd party motherboard/cable/socket board tooling. A high performance probe card is used to obtain an accurate Fowlar Nordheim plot that is unaffected by the probe card settling current. Magnum V TIU/DSA interface technology provides maximum signal performance with a single cable direct interconnect to the DSA (socket board). Handler specific TIU’s are available for multiple Techwing and Secron device handlers including TW322, TW-S7, TW350, and STH5600. The SSV and GV TIU’s interface 1.6Gbps digital channels to the handler DUT contactors.
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